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BAT 17-04W H6327产品简介:
ICGOO电子元器件商城为您提供BAT 17-04W H6327由Infineon设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供BAT 17-04W H6327价格参考以及InfineonBAT 17-04W H6327封装/规格参数等产品信息。 你可以下载BAT 17-04W H6327参考资料、Datasheet数据手册功能说明书, 资料中有BAT 17-04W H6327详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE SCHOTTKY 4V 130MA SOT323 |
产品分类 | RF 二极管 |
品牌 | Infineon Technologies |
数据手册 | http://www.infineon.com/dgdl/bat17series.pdf?folderId=db3a304314dca3890114ff6812070b44&fileId=db3a304314dca389011517d785d60d4e |
产品图片 | |
产品型号 | BAT 17-04W H6327 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | - |
不同 If、F时的电阻 | 15 欧姆 @ 5mA,10kHz |
不同 Vr、F时的电容 | 0.75pF @ 0V,1MHz |
二极管类型 | 肖特基 - 1 对串联 |
供应商器件封装 | PG-SOT323-3 |
其它名称 | BAT 17-04W H6327CT |
功率耗散(最大值) | 150mW |
包装 | 剪切带 (CT) |
封装/外壳 | SC-70,SOT-323 |
标准包装 | 1 |
电压-峰值反向(最大值) | 4V |
电流-最大值 | 130mA |
BAT17... Silicon Schottky Diode • For mixer applications in VHF/UHF range • For high-speed switching application • Pb-free (RoHS compliant) package BAT17 BAT17-04 BAT17-05 BAT17-06W BAT17-07 BAT17-04W BAT17-05W (cid:1) (cid:1) (cid:1) (cid:1) (cid:5) (cid:1) (cid:3)(cid:2) (cid:3)(cid:4) (cid:3)(cid:2) (cid:3)(cid:4) (cid:3)(cid:2) (cid:3)(cid:4) (cid:3)(cid:2) (cid:3)(cid:4) (cid:2) (cid:4) (cid:2) (cid:4) (cid:2) (cid:4) (cid:2) (cid:4) (cid:2) (cid:4) ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Package Configuration L (nH) Marking S BAT17 SOT23 single 1.8 53s BAT17-04 SOT23 series 1.8 54s BAT17-04W SOT323 series 1.4 54s BAT17-05 SOT23 common cathode 1.8 55s BAT17-05W SOT323 common cathode 1.4 55s BAT17-06W SOT323 common anode 1.4 56s BAT17-07 SOT143 parallel pair 2 57s 1 2011-06-15
BAT17... Maximum Ratings at T = 25°C, unless otherwise specified A Parameter Symbol Value Unit Diode reverse voltage V 4 V R Forward current I 130 mA F Total power dissipation P mW tot BAT17, T ≤ 77°C 150 S BAT17-04, T ≤ 61°C 150 S BAT17-05,T ≤ 46°C 150 S BAT17-04W, -05W, -6W, T ≤ 92 °C 150 S BAT17-07, T ≤ 60 °C 150 S Junction temperature T 150 °C j Operating temperature range T -55 ... 125 op Storage temperature T -55 ... 150 stg Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) R K/W thJS BAT17 ≤ 490 BAT17-04, BAT17-07 ≤ 590 BAT17-05 ≤ 690 BAT17-04W, BAT17-05W, BAT17-06W ≤ 390 1For calculation of R please refer to Application Note Thermal Resistance thJA 2 2011-06-15
BAT17... Electrical Characteristics at T = 25°C, unless otherwise specified A Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage V 4 - - V (BR) I = 10 µA (BR) Reverse current I µA R V = 3 V - - 0.25 R V = 4 V - - 10 R V = 3 V, T = 60 °C - - 1.25 R A Forward voltage V mV F I = 0.1 mA 200 275 350 F I = 1 mA 250 340 450 F I = 10 mA 350 425 600 F Forward voltage matching1) ∆ V - - 20 F I = 1 mA F AC Characteristics Diode capacitance C 0.4 0.55 0.75 pF T V = 0 , f = 1 MHz R Differential forward resistance R - 8 15 Ω F I = 5 mA, f = 10 kHz F 1∆V is the difference between lowest and highest V in multiple diode component. F F 3 2011-06-15
BAT17... Diode capacitance C = ƒ (V ) Forward resistance r = ƒ (I ) T R f F f = 1MHz f = 10kHz 0.6 103 EHD07109 r Ω f pF 102 T C 0.4 0.3 101 0.2 0.1 100 0 0.5 1 1.5 2 2.5 3 3.5 4 V 5 10-1 100 101 mA 102 VR Ι F Reverse current I = ƒ(V ) Forward current I = ƒ (V ) R R F F T = Parameter T = Parameter A A 102 EHD07107 102 EHD07106 ΙR µA ΙF mA 101 TA=150˚C 101 T = -40˚C A 100 25˚C 85˚C 85˚C 100 150˚C 10-1 10-1 10-2 25˚C 10-3 10-2 0.0 1.0 2.0 3.0 V 4.0 0.0 0.1 0.2 0.3 0.4 0.5 V 0.6 V V R F 4 2011-06-15
BAT17... Forward current I = ƒ (T ) Forward current I = ƒ (T ) F S F S BAT17 BAT17-04, BAT17-07 140 140 mA mA 100 100 IF IF 80 80 60 60 40 40 20 20 0 0 0 15 30 45 60 75 90 105 120 °C 150 0 15 30 45 60 75 90 105 120 °C 150 TS TS Forward current I = ƒ (T ) F S BAT17-05 140 mA 100 F I 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 T S 5 2011-06-15
Package SOT143 BAT17... Package Outline 2.9±0.1 N. 1±0.1 B MI 1.9 5 0.1 MAX. 1 0. 4 3 5 1 1 ±0. X. X. ±0. 4 A A 3 2. M M 1. 1 2 0˚ 0˚ 0.2 1 1 A 0.08...0.15 0.8+0.1 -0.05 0.4+0.1 0...8˚ -0.05 0.25M B 0.2M A 1.7 Foot Print 0.8 1.2 0.8 9 0. 1 1. 1.2 0.8 0.9 0.8 Marking Layout (Example) Manufacturer RF s 6 2005, June 5 Date code (YM) Pin 1 BFP181 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 6 2. Pin 1 3.15 1.15 6 2011-06-15
Package SOT23 BAT17... Package Outline N. 1±0.1 MI 2.9±0.1 B 15 0.1 MAX. 0. 0.4-+00..0151) 1 3 2 C 2.4±0.15 10˚ MAX. 0.08...0.10˚ MAX.15 A1.3±0.1 0.95 0...8˚ 1.9 0.25M B C 0.2M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 9 0. 3 1. 0.8 1.2 0.9 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 0.2 2.132.65 8 Pin 1 3.15 1.15 7 2011-06-15
Package SOT323 BAT17... Package Outline 2±0.2 0.9±0.1 0.1 MAX. 0.3+0.1 3x -0.05 0.1M 0.1 A 3 2.1±0.1 MIN. 1.25±0.1 1 1 2 0. 0.65 0.65 0.15+-00..015 0.2M A Foot Print 0.6 6 1. 8 0. 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 3 2. Pin 1 2.15 1.1 8 2011-06-15
BAT17... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2011-06-15
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